With the continuous development of China's digital environment, the demand for high-speed and high-performance connection solutions in various industries is accelerating. As a global leader in electronic products and an innovator in connection technologies, Molex highlighted its latest solutions for AI-driven data centers and advanced connection technologies for the next generation of mobile devices and smart home appliances at the recently concluded electronica China 2025.

Roc Yang, Vice President of Sales for Molex China, said: "Molex is committed to meeting the evolving Chinese market. Our solutions can achieve faster data transmission, higher energy efficiency and seamless connection, meeting the most demanding application requirements of today."

Build the next-generation hyperscale data center

The world is increasingly interconnected, driving the growth of data generation and consumption. At the core of this interconnection revolution is the constantly evolving network of hyperscale data centers. These large-scale data centers prioritize density, scalability and modularization to meet the bandwidth-intensive application requirements brought about by the Internet of Things (IoT), streaming media, artificial intelligence (AI), machine learning, 1.6T networks and other high-speed applications. As China increasingly demands data processing and artificial intelligence-driven applications, the market demand for these high-performance and scalable data centers has also reached an unprecedented high.

Yang continued, "As the amount of data processed by China's hyperscale data centers keeps increasing, optimizing computing power within a limited space has become the main goal." By leveraging connector solutions designed and optimized for space and flexibility, hyperscale system architecture engineers can achieve higher server density and better performance.

Molex's solutions in this field include: the Mirror Mezz connector designed to provide excellent signal integrity at different stack heights; The NearStack PCIe connector system that eliminates paddle cards to reduce space requirements; The Kickstart connector system integrates power and signal circuits into a single flat cable assembly. Furthermore, the NextStream connector system supports PCIe Gen 6 speed in a compact package with a low configuration and high cost.

Optimize the design of mobile devices and smart home appliances for China

In addition, Molex showcased a series of high-performance connection solutions at the conference, aiming to meet the evolving demands of major industries in China, such as consumer electronics, automotive, industrial automation, and medical technology. The exhibited products include:

The Pico-Clasp connector -Molex's core 1.00mm pitch, wire-to-board Pico-Clasp connector is a multi-functional system that offers a variety of electroplating and design options, with circuit numbers ranging from 2 to 50, and is available in a wide pin socket type. It is an ideal choice for space-constrained applications. A variety of design options, including gold and tin plating, make the design more flexible and keep the product range simple.

The Micro-Lock Plus- The Micro-Lock Plus 1.25mm pitch connector system is an ideal choice for compact applications, featuring electrical and mechanical reliability, design flexibility, and safe connection holding force, and can overcome various challenges in high-temperature designs (up to 105°C). Visitors can learn how the compact size, wide positive latch and safe mating holding force of the Micro-Lock Plus wire-to-wire and wire-to-board connectors reduce assembly errors while helping to avoid common problems in high-temperature environments.